Here's another question:

When using a multimeter to test continuity to ground, should there be a reading from the solder blob?  I get good readings from the bits of wire in the joint, but not always from the blobbiest parts of the joints (ie:  the peaks of the solder material).  I'm using very good solder wire.  So, if there's a fault, it's me; not the material.

Please, someone, let me know if this is likely at issue.